公开(公告)号：US10586775B2

公开(公告)日：2020-03-10

申请号：US16174934

申请日：2018-10-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong-Uk Kim ,  Il-Joon Kim

IPC: H01L23/498 ,  H01L23/66 ,  H01L25/065 ,  H01L25/10 ,  H01L23/00 ,  H03H7/01 ,  H03H7/38 ,  H03H1/00

Abstract: A memory package includes a multi-level package substrate, a first memory chip, a second memory chip, a first band pass filter and a second band pass filter. The multi-level package substrate includes a plurality of wiring layers and a plurality of insulating layers alternately stacked on one another. The first memory chip is on the multi-level package substrate, and includes a plurality of first memory cells and a first receiver. The second memory chip is on the first memory chip, and includes a plurality of second memory cells and a second receiver. The first band pass filter is in the multi-level package substrate, is connected to the first receiver, and passes a first data signal within a first frequency band. The second band pass filter is in the multi-level package substrate, is connected to the second receiver, and passes a second data signal within the first frequency band.

公开(公告)号：US20190229076A1

公开(公告)日：2019-07-25

申请号：US16174934

申请日：2018-10-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong-Uk Kim ,  Il-Joon Kim

IPC: H01L23/66 ,  H01L25/065 ,  H01L25/10 ,  H01L23/00 ,  H01L23/498 ,  H03H7/01 ,  H03H7/38

Abstract: A memory package includes a multi-level package substrate, a first memory chip, a second memory chip, a first band pass filter and a second band pass filter. The multi-level package substrate includes a plurality of wiring layers and a plurality of insulating layers alternately stacked on one another. The first memory chip is on the multi-level package substrate, and includes a plurality of first memory cells and a first receiver. The second memory chip is on the first memory chip, and includes a plurality of second memory cells and a second receiver. The first band pass filter is in the multi-level package substrate, is connected to the first receiver, and passes a first data signal within a first frequency band. The second band pass filter is in the multi-level package substrate, is connected to the second receiver, and passes a second data signal within the first frequency band.