公开(公告)号：US20230286108A1

公开(公告)日：2023-09-14

申请号：US17931948

申请日：2022-09-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Donghoon Kwon ,  Hyojung Kim ,  Chungki Min ,  Kihoon Jang

IPC: B24B55/02 ,  B24B57/02 ,  B24B37/10 ,  B24B37/34 ,  B24B53/017

CPC classification number: B24B55/02 ,  B24B57/02 ,  B24B37/107 ,  B24B37/34 ,  B24B53/017

Abstract: A polishing apparatus for a substrate, includes: a platen having a polishing pad attached to an upper surface thereof, and configured to rotate in a rotational direction, a temperature control unit configured to spray a temperature control fluid onto the polishing pad, a slurry supply unit configured to supply a slurry to the polishing pad, a polishing head on the polishing pad, and configured to rotate a semiconductor substrate in contact with the polishing pad, and a first fence between the temperature control unit and the slurry supply unit extending from a center outwardly, along the rotational direction, to control a flow of the temperature control fluid, wherein the temperature control unit, the slurry supply unit, and the polishing head are sequentially positioned along the rotational direction.