公开(公告)号：US20240170458A1

公开(公告)日：2024-05-23

申请号：US18471678

申请日：2023-09-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min Seung Ji ,  Ha Seob Seong ,  Ae-Nee Jang

IPC: H01L25/065 ,  H01L21/56 ,  H01L21/768 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498

CPC classification number: H01L25/0657 ,  H01L21/565 ,  H01L21/76898 ,  H01L23/3121 ,  H01L23/481 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2225/06541 ,  H01L2924/3511

Abstract: A semiconductor package and a method of fabricating the same are provided. The semiconductor package includes a first semiconductor chip; a chip stack including a plurality of second semiconductor chips, which are stacked on the first semiconductor chip; a first molding layer in contact with an upper surface of the first semiconductor chip and side surfaces of the chip stack and exposing an upper surface of the chip stack; a bonding layer in contact with an upper surface of the first molding layer and the upper surface of the chip stack; a dummy semiconductor chip on the bonding layer; and a second molding layer on at least part of the dummy semiconductor chip and on the bonding layer, wherein the upper surface of the chip stack has a wavy shape, and an upper surface of the bonding layer is flat.