公开(公告)号：US20230117865A1

公开(公告)日：2023-04-20

申请号：US17862459

申请日：2022-07-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eungchang LEE ,  Bangweon LEE ,  Jae Choon KIM ,  Kyung Suk OH

IPC: H01L23/367 ,  H01L25/065 ,  H01L25/10 ,  H01L23/00 ,  H01L23/498

Abstract: A semiconductor package including a substrate and at least one semiconductor chip on the substrate may be provided. The substrate may include a body layer having a top surface and a bottom surface, a first thermal conductive plate on the top surface of the body layer, the first thermal conductive plate connected to a ground terminal of the semiconductor chip, and a thermal conductive via penetrating the body layer and being in contact with the first thermal conductive plate.