公开(公告)号：US20160093518A1

公开(公告)日：2016-03-31

申请号：US14788783

申请日：2015-06-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyu-Dong JUNG ,  Jung-Hwan KIM ,  Dong-Gil LEE ,  Tae-Je CHO ,  Kwang-Chul CHOI

IPC: H01L21/67 ,  B32B43/00

CPC classification number: H01L21/67115 ,  B32B38/10 ,  B32B41/00 ,  B32B43/006 ,  B32B2250/02 ,  B32B2310/0843 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67253 ,  H01L2221/68381 ,  H01L2224/98 ,  Y10T156/1158 ,  Y10T156/1917

Abstract: Provided are an initiator and a method for debonding a wafer supporting system. The initiator for debonding a wafer supporting system includes a rotation chuck having an upper surface on which a wafer supporting system (WSS), which includes a carrier wafer, a device wafer, and a glue layer for bonding the carrier wafer and the device wafer to each other, is seated to rotate the wafer supporting system, a detecting module detecting a height and a thickness of the glue layer and a laser module generating a fracture portion on the glue layer through irradiating a side surface of the glue layer with a laser on the basis of the height and the thickness of the glue layer.

Abstract translation: 提供了一种用于剥离晶片支撑系统的引发剂和方法。 用于剥离晶片支撑系统的启动器包括具有上表面的旋转卡盘，其上包括载体晶片的晶片支撑系统（WSS），器件晶片和用于将载体晶片和器件晶片接合的胶层 彼此坐下来旋转晶片支撑系统，检测模块检测胶层的高度和厚度;以及激光模块，其通过用激光照射胶层的侧表面而在胶层上产生断裂部分 胶层的高度和厚度的基础。