公开(公告)号：US20250153273A1

公开(公告)日：2025-05-15

申请号：US18650525

申请日：2024-04-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Da Woon LEE ,  Jae Heung LEE ,  Nam-Tae HEO

IPC: B23K26/06 ,  B23K26/03 ,  B23K26/08 ,  B23K26/38 ,  B23K101/40

Abstract: A wafer processing apparatus may include a light source unit emitting a first beam, a first spatial laser modulator reflecting the first beam, a beam expander adjusting a divergence angle of the first beam, a sensor unit emitting a second beam, a second spatial laser modulator reflecting the second beam, a galvanometer reflecting the first beam or the second beam, and a condensing lens refracting the first beam or the second beam. The sensor unit may receive position information generated while the second beam is moving in a first direction on a wafer. The first beam may be condensed to a condensing point by the condensing lens. Angle information for controlling a height level of the condensing point may be generated based on the position information. The beam expander may adjust the divergence angle of the first beam based on the angle information.