公开(公告)号：US11315802B2

公开(公告)日：2022-04-26

申请号：US16293697

申请日：2019-03-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Il Hwan Kim ,  Un Byoung Kang ,  Chung Sun Lee

IPC: H01L21/48 ,  H01L21/56 ,  H01L23/498 ,  H01L21/683 ,  H01L23/00

Abstract: A method of manufacturing a semiconductor package includes forming a plurality of trenches at a first surface of a silicon substrate, forming a conductive pad inside each of the plurality of trenches, forming a redistribution layer on the first surface of the silicon substrate, forming an external connection terminal on a first surface of the redistribution layer, removing the silicon substrate to expose each conductive pad, mounting a semiconductor chip to be connected to the conductive pads, and forming an encapsulant to cover at least one surface of the semiconductor chip.

公开(公告)号：US10957833B2

公开(公告)日：2021-03-23

申请号：US16356283

申请日：2019-03-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tan Sakong ,  Yong Il Kim ,  Han Kyu Seong ,  Ji Hye Yeon ,  Chung Sun Lee ,  Ji Hwan Hwang

IPC: H01L33/00 ,  H01L33/62 ,  H01L25/075 ,  H01L27/12 ,  H01L23/00

Abstract: A light emitting diode display device includes a display board comprising a plurality of unit pixels, a drive circuit board including a plurality of drive circuit regions corresponding to the plurality of unit pixels, and a plurality of bumps interposed between the plurality of unit pixels and the plurality of drive circuit regions. The plurality of unit pixels comprises a first unit pixel including a first P electrode. The plurality of drive circuit regions comprises a first drive circuit region corresponding to the first unit pixel and a first pad connected to a first drive transistor, the plurality of bumps includes a first solder in contact with the first pad, and a first bump on the first solder and including a first filler in contact with the first P electrode, the first solder includes at least one of tin and silver, and the first filler includes copper or nickel.