公开(公告)号：US20220189835A1

公开(公告)日：2022-06-16

申请号：US17376883

申请日：2021-07-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Choongbin YIM ,  Dongwook KIM ,  Hyunki KIM ,  Jongbo SHIM ,  Jihwang KIM ,  Sungkyu PARK ,  Yongkwan LEE ,  Byoungwook JANG

IPC: H01L23/12 ,  H01L23/538

Abstract: A semiconductor package including a first package substrate, a first semiconductor chip on the first package substrate, a first conductive connector on the first package substrate and laterally spaced apart from the first semiconductor chip, an interposer substrate on the first semiconductor chip and electrically connected to the first package substrate through the first conductive connector, the interposer substrate including a first portion overlapping the first semiconductor chip and a plurality of upper conductive pads in the first portion, a plurality of spacers on a lower surface of the first portion of the interposer substrate and positioned so as not to overlap the plurality of upper conductive pads in a plan view, and an insulating filler between the interposer substrate and the first package substrate may be provided.