公开(公告)号：US20230005917A1

公开(公告)日：2023-01-05

申请号：US17901210

申请日：2022-09-01

Applicant: Samsung Electronics Co., LTD.

Inventor： Cheonbae KIM ,  Seungjin KIM ,  Dongkyun LEE

IPC: H01L27/108 ,  H01L49/02 ,  H01L29/78

Abstract: A semiconductor device is provided. The semiconductor device includes a plurality of lower electrodes arranged on a semiconductor substrate in a honeycomb structure; and a support connected to the plurality of lower electrodes and defining a plurality of open areas through which the plurality of lower electrodes are exposed. A center point of each of the plurality of open areas is arranged at a center point of a triangle formed by center points of three corresponding neighboring lower electrodes among the plurality of lower electrodes.