CONDUCTIVE BONDING STRUCTURE FOR SUBSTRATES AND DISPLAY DEVICE INCLUDING THE SAME

    公开(公告)号:US20220137739A1

    公开(公告)日:2022-05-05

    申请号:US17366246

    申请日:2021-07-02

    Abstract: A substrate conductive bonding structure includes a lower substrate including a connection pad exposed to outside the lower substrate, an upper substrate including a transfer pad overlapping the connection pad, exposed to outside the upper substrate and including an upper surface, and a slit defined in the transfer pad, overlapping the connection pad and open at the upper surface of the transfer pad, the slit including an extending portion extending along a first direction and having a first slit width along a second direction crossing the first direction, and an expansion portion connected to the extending portion and having a second slit width along the second direction which is larger than the first slit width, and a solder contacting the upper surface of the connection pad, extending to the upper surface of the transfer pad and into the slit.

    DISPLAY DEVICE, APPARATUS FOR MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING THE DISPLAY DEVICE

    公开(公告)号:US20220173286A1

    公开(公告)日:2022-06-02

    申请号:US17477695

    申请日:2021-09-17

    Abstract: A manufacturing method of a display device includes providing a display module including a display panel, a first flexible circuit board disposed at a first side edge of the display panel, a window disposed on the display panel, and an optical film disposed between the display panel and the window on the stage; aligning the display module such that the first side edge is disposed under the bonding unit; moving the position detection sensor along the first side edge of the display module to sense a first coating path; moving the resin supply unit along the sensed first coating path to coat a first filling agent between the window and the display panel; and moving the light irradiation unit along the sensed first coating path to cure the coated first filling agent to form a first filling layer.

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