公开(公告)号：US20220285651A1

公开(公告)日：2022-09-08

申请号：US17452766

申请日：2021-10-28

Applicant: Samsung Display Co., Ltd.

Inventor： Jieun Ko ,  YOHAN KIM ,  YISU KIM ,  WONMIN YUN ,  BYOUNGDUK LEE ,  SEUNGJU LEE ,  JAEHYUK LEE ,  Hyungdong Lee ,  YOONHYEUNG CHO ,  HYEONSEO CHO

IPC: H01L51/52

Abstract: An encapsulation structure includes an organic encapsulation layer. The organic encapsulation layer includes a base resin and hygroscopic composite particles including a hygroscopic composite particle. The hygroscopic composite particle includes a core and a silica layer around the core. The core includes a polymer. The silica layer includes silica.