Polishing apparatus
    1.
    发明授权

    公开(公告)号:US10040163B2

    公开(公告)日:2018-08-07

    申请号:US15166163

    申请日:2016-05-26

    Abstract: A polishing apparatus includes a jig unit including a substrate supporting part having a placing surface on which a substrate having a first curvature is placed. The placing surface has a second curvature corresponding to the first curvature and a polishing unit includes at least one polishing part to be rotated to polish a process surface of the substrate. The process surface of the curved substrate may be uniformly polished and foreign substances generated during the polishing process are prevented from entering into the substrate.

    POLISHING APPARATUS
    2.
    发明申请
    POLISHING APPARATUS 审中-公开
    抛光装置

    公开(公告)号:US20170057047A1

    公开(公告)日:2017-03-02

    申请号:US15166163

    申请日:2016-05-26

    CPC classification number: B24B29/04

    Abstract: A polishing apparatus includes a jig unit including a substrate supporting part having a placing surface on which a substrate having a first curvature is placed. The placing surface has a second curvature corresponding to the first curvature and a polishing unit includes at least one polishing part to be rotated to polish a process surface of the substrate. The process surface of the curved substrate may be uniformly polished and foreign substances generated during the polishing process are prevented from entering into the substrate.

    Abstract translation: 抛光装置包括夹具单元,该夹具单元包括具有放置表面的基板支撑部分,其上放置有具有第一曲率的基板。 所述放置表面具有对应于所述第一曲率的第二曲率,并且抛光单元包括至少一个要旋转以抛光所述基底的处理表面的抛光部分。 可以均匀地抛光弯曲基板的工艺表面,防止在抛光过程中产生的异物进入基板。

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