公开(公告)号：US20140098005A1

公开(公告)日：2014-04-10

申请号：US13747971

申请日：2013-01-23

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Dong-Ho Kim ,  Kyu-Bong Jung

IPC: G06F3/14

CPC classification number: G06F3/1446 ,  G09G2300/026 ,  G09G2380/02 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In an aspect, an array substrate for a flexible display device is provided, the array substrate including: a mother substrate; a plurality of display units that are spaced apart from each other on the mother substrate, the plurality of display units each including a display region for displaying an image and a non-display region extending from the display region; a sealing unit covering the display region of each of the plurality of display units; and a plurality of test wire lines formed in a wire region between the adjacent display units on the mother substrate, that are electrically connected to each of the plurality of display units, and having a pattern.

Abstract translation: 在一方面中，提供了一种用于柔性显示装置的阵列基板，所述阵列基板包括：母基板; 多个显示单元，其在母基板上彼此间隔开，多个显示单元各自包括用于显示图像的显示区域和从显示区域延伸的非显示区域; 覆盖所述多个显示单元中的每一个的显示区域的密封单元; 以及形成在母基板上的相邻显示单元之间的导线区域中的多个测试线线，其电连接到多个显示单元中的每一个并具有图案。

公开(公告)号：US09775248B2

公开(公告)日：2017-09-26

申请号：US14862549

申请日：2015-09-23

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Dong-Ho Kim

IPC: H05K1/00 ,  H05K1/18 ,  H05K1/14 ,  H05K1/11 ,  H01L27/32

CPC classification number: H05K1/189 ,  H01L27/3276 ,  H05K1/111 ,  H05K1/147 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10128 ,  Y02P70/611

Abstract: A display device including a flexible circuit board including an insulation film, the insulation film including an input pad part and an output pad part on a first side thereof; a printed circuit board including a first pad part, the first pad part being connected to the input pad part; and a display panel including a second pad part, the second pad part being connected to the output pad part, wherein the input pad part includes a plurality of input pads that are arranged in at least two pad columns, and the flexible circuit board includes a plurality of dummy layers aligned with the plurality of input pads on a second side of the insulation film, the second side being an opposite side to the first side.

公开(公告)号：US09448757B2

公开(公告)日：2016-09-20

申请号：US13747971

申请日：2013-01-23

Applicant: Samsung Display Co., Ltd.

Inventor： Dong-Ho Kim ,  Kyu-Bong Jung

IPC: G09G3/32 ,  H01L23/58 ,  G06F3/14 ,  H01L21/66

CPC classification number: G06F3/1446 ,  G09G2300/026 ,  G09G2380/02 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In an aspect, an array substrate for a flexible display device is provided, the array substrate including: a mother substrate; a plurality of display units that are spaced apart from each other on the mother substrate, the plurality of display units each including a display region for displaying an image and a non-display region extending from the display region; a sealing unit covering the display region of each of the plurality of display units; and a plurality of test wire lines formed in a wire region between the adjacent display units on the mother substrate, that are electrically connected to each of the plurality of display units, and having a pattern.

Abstract translation: 在一方面中，提供了一种用于柔性显示装置的阵列基板，所述阵列基板包括：母基板; 多个显示单元，其在母基板上彼此间隔开，多个显示单元各自包括用于显示图像的显示区域和从显示区域延伸的非显示区域; 覆盖所述多个显示单元中的每一个的显示区域的密封单元; 以及形成在母基板上的相邻显示单元之间的导线区域中的多个测试线线，其电连接到多个显示单元中的每一个并具有图案。

公开(公告)号：US09691814B2

公开(公告)日：2017-06-27

申请号：US14255937

申请日：2014-04-17

Applicant: Samsung Display Co., Ltd.

Inventor： Dong-Ho Kim

IPC: G06K9/00 ,  H01L27/15 ,  H01L23/498

CPC classification number: H01L27/156 ,  H01L23/4985 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A chip-on-film (COF) package includes a base film, an integrated circuit chip, and a plurality of signal interconnections. The base film includes a bonding region and a non-bonding region. The integrated circuit chip is at the non-bonding region. Each of the plurality of signal interconnections is coupled to the integrated circuit chip and extend to the bonding region along a first direction. The plurality of signal interconnections are spaced from each other along a second direction substantially crossing the first direction. The plurality of signal interconnections alternate on a first surface and a second surface opposite to the first surface of the base film along the second direction.

公开(公告)号：US20140097429A1

公开(公告)日：2014-04-10

申请号：US13747863

申请日：2013-01-23

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Dong-Ho Kim ,  Sung-Un Park

IPC: H01L33/52 ,  H01L27/15

CPC classification number: H01L33/52 ,  H01L27/1262 ,  H01L27/15

Abstract: In an aspect, an array substrate for a flexible display device and a method of manufacturing the array substrate, the method including operations of arranging at least one lower protective film on which a plurality of display units that are covered by thin-film encapsulation (TFE) units are arrayed; performing half cutting and full cutting on the at least one lower protective film; and completing the manufacture of each of the plurality of display units by removing remaining parts on the at least one lower protective film from the half cutting and full cutting is provided.

Abstract translation: 在一方面，一种柔性显示装置用阵列基板和阵列基板的制造方法，其特征在于，包括：将至少一个下保护膜配置在其上的多个由薄膜封装覆盖的显示单元（TFE） ）单位排列; 在所述至少一个下保护膜上进行半切割和全切割; 并且通过从半切割和全切割中去除至少一个下保护膜上的剩余部分来完成多个显示单元中的每一个的制造。

公开(公告)号：US20150076531A1

公开(公告)日：2015-03-19

申请号：US14255937

申请日：2014-04-17

Applicant: Samsung Display Co., Ltd.

Inventor： Dong-Ho Kim

IPC: H01L23/538 ,  H01L27/15

CPC classification number: H01L27/156 ,  H01L23/4985 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A chip-on-film (COF) package includes a base film, an integrated circuit chip, and a plurality of signal interconnections. The base film includes a bonding region and a non-bonding region. The integrated circuit chip is at the non-bonding region. Each of the plurality of signal interconnections is coupled to the integrated circuit chip and extend to the bonding region along a first direction. The plurality of signal interconnections are spaced from each other along a second direction substantially crossing the first direction. The plurality of signal interconnections alternate on a first surface and a second surface opposite to the first surface of the base film along the second direction.

Abstract translation: 片上电影（COF）封装包括基膜，集成电路芯片和多个信号互连。 基膜包括接合区域和非接合区域。 集成电路芯片处于非接合区域。 多个信号互连中的每一个耦合到集成电路芯片并且沿着第一方向延伸到接合区域。 多个信号互连沿着基本上与第一方向交叉的第二方向彼此间隔开。 多个信号互连沿着第二方向在基膜的第一表面和与第一表面相对的第二表面上交替。

公开(公告)号：US08841150B2

公开(公告)日：2014-09-23

申请号：US13747863

申请日：2013-01-23

Applicant: Samsung Display Co., Ltd.

Inventor： Dong-Ho Kim ,  Sung-Un Park

IPC: H01L21/46 ,  H01L33/52 ,  H01L27/15

CPC classification number: H01L33/52 ,  H01L27/1262 ,  H01L27/15

Abstract: In an aspect, an array substrate for a flexible display device and a method of manufacturing the array substrate, the method including operations of arranging at least one lower protective film on which a plurality of display units that are covered by thin-film encapsulation (TFE) units are arrayed; performing half cutting and full cutting on the at least one lower protective film; and completing the manufacture of each of the plurality of display units by removing remaining parts on the at least one lower protective film from the half cutting and full cutting is provided.

Abstract translation: 在一方面，一种柔性显示装置用阵列基板和阵列基板的制造方法，其特征在于，包括：将至少一个下保护膜配置在其上的多个由薄膜封装覆盖的显示单元（TFE） ）单位排列; 在所述至少一个下保护膜上进行半切割和全切割; 并且通过从半切割和全切割中去除至少一个下保护膜上的剩余部分来完成多个显示单元中的每一个的制造。