公开(公告)号：US20220371138A1

公开(公告)日：2022-11-24

申请号：US17680633

申请日：2022-02-25

Applicant: Samsung Display Co., LTD.

Inventor： Doo Seon YU ,  Gyung Min BAEK ,  Hyun Eok SHIN ,  You Jong LEE ,  Myung Soo HUH

IPC: B23Q7/14 ,  B23Q11/10

Abstract: An in-line manufacturing apparatus includes a carrier that transports a substrate, a plurality of process chambers subjected to a manufacturing process on the substrate transported through the carrier, and a cooling part disposed adjacent to the carrier and movable with the carrier.

公开(公告)号：US20140034483A1

公开(公告)日：2014-02-06

申请号：US13795342

申请日：2013-03-12

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： You Jong LEE

IPC: C23C14/35

CPC classification number: C23C14/35 ,  C23C14/354 ,  H01J37/321 ,  H01J37/3405 ,  H01J37/3444

Abstract: A thin film deposition apparatus includes a process chamber that includes a reaction space, a plasma generating unit, and a sputtering unit. The plasma generating unit generates a plasma in the reaction space. The sputtering unit is independently driven from the plasma generating unit to form an electric field in the reaction space and to perform a sputtering process on a target using the plasma.

Abstract translation: 薄膜沉积设备包括包括反应空间的处理室，等离子体产生单元和溅射单元。 等离子体生成单元在反应空间中产生等离子体。 溅射单元独立地从等离子体发生单元驱动，以在反应空间中形成电场，并使用等离子体对靶进行溅射处理。

公开(公告)号：US20250029819A1

公开(公告)日：2025-01-23

申请号：US18910046

申请日：2024-10-09

Applicant: Samsung Display Co., LTD.

Inventor： You Jong LEE ,  Nam Wook KANG ,  Cheol Lae ROH ,  Doo Seon YU ,  Jeong Il LEE ,  Myung Soo HUH

IPC: H01J37/34 ,  C23C14/34 ,  C23C14/35

Abstract: A sputtering apparatus includes: a first cylindrical target and a second cylindrical target, which are arranged in a first direction and parallel to each other; a first magnet disposed in the first cylindrical target; a second magnet disposed in the second cylindrical target; and a substrate holder spaced apart from the first and second cylindrical targets in a second direction which is perpendicular to the first direction, wherein each of a first angle formed by a first imaginary straight line from a center of the first magnet to a cylindrical axis of the first cylindrical target with a first perpendicular line and a second angle formed by a second imaginary straight line from a center to of the second magnet to a cylindrical axis of the second cylindrical target with a second perpendicular line is in a range of about 30 degrees to about 180 degrees.

公开(公告)号：US20230085216A1

公开(公告)日：2023-03-16

申请号：US17687961

申请日：2022-03-07

Applicant: Samsung Display Co., LTD.

Inventor： You Jong LEE ,  Nam Wook KANG ,  Cheol Lae ROH ,  Doo Seon YU ,  Jeong Il LEE ,  Myung Soo HUH

IPC: H01J37/34 ,  C23C14/35

Abstract: A sputtering apparatus includes: a first cylindrical target and a second cylindrical target, which are arranged in a first direction and parallel to each other; a first magnet disposed in the first cylindrical target; a second magnet disposed in the second cylindrical target; and a substrate holder spaced apart from the first and second cylindrical targets in a second direction which is perpendicular to the first direction, wherein each of a first angle formed by a first imaginary straight line from a center of the first magnet to a cylindrical axis of the first cylindrical target with a first perpendicular line and a second angle formed by a second imaginary straight line from a center to of the second magnet to a cylindrical axis of the second cylindrical target with a second perpendicular line is in a range of about 30 degrees to about 180 degrees.