Display device with fusion region overlapping metal wiring

    公开(公告)号:US11812629B2

    公开(公告)日:2023-11-07

    申请号:US17107705

    申请日:2020-11-30

    CPC classification number: H10K50/8426 H10K59/131 H10K71/00 H10K77/10

    Abstract: A display device includes a display panel including a display area and a non-display area surrounding the display area, and a metal wiring layer disposed on at least a portion of the non-display area, an encapsulation substrate disposed on the display panel, a sealing member which is disposed between the display panel and the encapsulation substrate and bonds the display panel to the encapsulation substrate and a first fusion region provided in at least a partial region between the sealing member and the encapsulation substrate, where the first fusion region has no physical boundary, and where at least a portion of the sealing member is disposed on the metal wiring layer in the non-display area, and the first fusion region is separated from the metal wiring layer while overlapping the metal wiring layer in a thickness direction.

    Display panel having sealing member including arrangement of melting patterns and fusing patterns

    公开(公告)号:US11450833B2

    公开(公告)日:2022-09-20

    申请号:US17062245

    申请日:2020-10-02

    Abstract: A display device includes a display panel including a display area and non-display areas surrounding the display area; an encapsulation substrate disposed on the display panel and including melting patterns formed in regions overlapping the non-display areas; a sealing member disposed between the display panel and the encapsulation substrate to couple the display panel with the encapsulation substrate; and fusing patterns disposed across the sealing member and the encapsulation substrate. The display panel further includes a metal line layer disposed in at least a portion of the non-display areas, at least a portion of the sealing member is disposed on the metal line layer in the non-display areas, the melting patterns are disposed to overlap the metal line layer in a thickness direction, and the fusing patterns are disposed not to overlap the metal line layer in the thickness direction.

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