Deposition apparatus including a heat dissipation member

    公开(公告)号:US11078571B2

    公开(公告)日:2021-08-03

    申请号:US16709152

    申请日:2019-12-10

    Abstract: A deposition apparatus includes a chamber, a deposition source, and a stage disposed in the chamber with a target object mounted thereon. The deposition apparatus further includes a first plate coupled to the chamber, and a second plate disposed between the first plate and the stage, wherein the second plate includes a plurality of diffusion holes. The deposition apparatus additionally includes a heat dissipation member in contact with the first plate and the second plate, wherein the heat dissipation member includes a plurality of sidewall portions, wherein the plurality of sidewall portions are connected to each other. The deposition apparatus further includes a spacer coupled to a first sidewall portion of the plurality of sidewall portions and disposed between the first plate and the second plate, wherein the spacer extends parallel to the first sidewall portion.

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