公开(公告)号：US20250157982A1

公开(公告)日：2025-05-15

申请号：US18944300

申请日：2024-11-12

Applicant: STMicroelectronics International N.V.

Inventor： Guendalina CATALANO ,  Oscar DI MAURO

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/495

Abstract: A semiconductor die is arranged at a mounting surface of a substrate via electrically conductive pillars protruding from the semiconductor die with distal ends of the electrically conductive pillars in electrical contact with the mounting surface of the substrate. The substrate has, at the mounting surface, two or more alignment bushings configured to have inserted therein respective electrically conductive pillars. Selected ones of the electrically conductive pillars protruding from the semiconductor die are inserted into the two or more alignment bushings at the mounting surface of the substrate. The pillars inserted into the alignment bushings counter movement of the semiconductor die with respect to the substrate.