公开(公告)号：US08691684B2

公开(公告)日：2014-04-08

申请号：US13906223

申请日：2013-05-30

Applicant: STMicroelectronics (Shenzhen) R&D Co. Ltd.

Inventor： Guo Hua Zhong ,  Mei Yang

IPC: H01L21/44

CPC classification number: H01L21/4871 ,  H01L23/4824 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A power transistor for use in an audio application is laid out to minimize hot spots. Hot spots are created by non-uniform power dissipation or overly concentrated current densities. The source and drain pads are disposed relative to each other to facilitate uniform power dissipation. Interleaving metal fingers and upper metal layers are connected directly to lower metal layers in the absence of vias to improve current density distribution. This layout improves some fail detection tests by 17%.

Abstract translation: 布置用于音频应用的功率晶体管以最小化热点。 热点由不均匀的功耗或过度集中的电流密度产生。 源极和漏极焊盘相对于彼此设置以促进均匀的功率耗散。 在没有通孔的情况下，交叉金属指和上金属层直接连接到下金属层，以改善电流密度分布。 这种布局改进了17％的失败检测测试。

公开(公告)号：US20130267087A1

公开(公告)日：2013-10-10

申请号：US13906223

申请日：2013-05-30

Applicant: STMicroelectronics (Shenzhen) R&D Co. Ltd.

Inventor： Guo Hua Zhong ,  Mei Yang

IPC: H01L21/48

CPC classification number: H01L21/4871 ,  H01L23/4824 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A power transistor for use in an audio application is laid out to minimize hot spots. Hot spots are created by non-uniform power dissipation or overly concentrated current densities. The source and drain pads are disposed relative to each other to facilitate uniform power dissipation. Interleaving metal fingers and upper metal layers are connected directly to lower metal layers in the absence of vias to improve current density distribution. This layout improves some fail detection tests by 17%.

Abstract translation: 布置用于音频应用的功率晶体管以最小化热点。 热点由不均匀的功耗或过度集中的电流密度产生。 源极和漏极焊盘相对于彼此设置以促进均匀的功率耗散。 在没有通孔的情况下，交叉金属指和上金属层直接连接到下金属层，以改善电流密度分布。 这种布局改进了17％的失败检测测试。