公开(公告)号：US20240343055A1

公开(公告)日：2024-10-17

申请号：US18619148

申请日：2024-03-27

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HyunSeok PARK ,  KyoWang KOO ,  SeongKuk KIM ,  SeokBeom HEO

IPC: B41N1/24 ,  B23K1/00 ,  B23K1/20 ,  B23K101/40 ,  B41C1/14 ,  B41M1/12 ,  B41M1/26 ,  G03F7/00 ,  H01L23/00

CPC classification number: B41N1/248 ,  B23K1/0016 ,  B23K1/203 ,  B41C1/148 ,  B41M1/12 ,  B41M1/26 ,  G03F7/0035 ,  H01L24/11 ,  H01L24/81 ,  B23K2101/40 ,  H01L2224/1147 ,  H01L2224/81815

Abstract: A selective stencil mask and a stencil printing method are provided. The stencil mask is for printing a fluid material onto a substrate, and comprises: a stencil member comprising: at least one printing region each having an array of apertures that allow the fluid material to flow therethrough and deposit onto the substrate; and a blocking region configured to prevent the fluid material from flowing therethrough; and a supporting member attached to the stencil member and configured to, when the stencil mask is placed on the substrate, contact the substrate and create a gap between the stencil member and the substrate.