公开(公告)号：US20230143368A1

公开(公告)日：2023-05-11

申请号：US17802283

申请日：2020-11-27

Applicant: SOUTHERN UNIVERSITY OF SCIENCE AND TECHNOLOGY

Inventor： Bi ZHANG ,  Sai GUO ,  Jingfei YIN ,  Xiuxuan YANG

IPC: B24B49/00 ,  B24B49/10 ,  B24B1/04

CPC classification number: B24B49/006 ,  B24B49/10 ,  B24B1/04

Abstract: Disclosed are a machining method and a machining device improving machining efficiency and preserving workpiece surface integrity. The machining method improving machining efficiency and preserving workpiece surface integrity includes: setting a workpiece (300) and a machining unit (400); and machining the workpiece (300) by the machining unit (400) at a preset machining speed, wherein the preset machining speed is not lower than a machining speed corresponding to the embrittlement of the workpiece material. By the machining method, the machining speed of the machining unit (400) is set during machining, which results in “skin effect” of subsurface damage caused by the embrittlement of the workpiece material (300) and enables the damage depth of the workpiece (300) to be confined in a shallow subsurface layer, so that the damage depth of the workpiece (300) is reduced, the workpiece integrity is preserved, and the machining quality and the machining efficiency are improved.