公开(公告)号：US20240401855A1

公开(公告)日：2024-12-05

申请号：US18802836

申请日：2024-08-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taeil KIM ,  Sukho LEE ,  Min CHANG ,  Sangyoon HAN

IPC: F25B41/31 ,  F25B13/00

Abstract: A heat pump system according to an aspect of the disclosure may comprise: a compressor configured to compress a refrigerant; a water heat exchanger configured to exchange heat between the compressed refrigerant and introduced water; an expansion valve configured to expand the refrigerant condensed in the water heat exchanger; an outdoor heat exchanger configured to exchange heat between the refrigerant expanded by the expansion valve and outdoor air; a high-tension pressure sensor configured to detect the temperature of the refrigerant to be condensed in the water heat exchanger; a discharged water temperature sensor configured to detect the temperature of water on which heat exchange has been performed in the water heat exchanger; and a control unit including a controller comprising circuitry configured to: determine a target condensation temperature of the refrigerant based on a detection result of the discharged water temperature sensor, compare the target condensation temperature with the current condensation temperature detected by the high-tension pressure sensor, and control the degree of opening of the expansion valve based on the comparison result.

公开(公告)号：US20210398913A1

公开(公告)日：2021-12-23

申请号：US17466750

申请日：2021-09-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongjoon OH ,  Sukho LEE ,  Jusuk KANG

IPC: H01L23/552 ,  H01L23/495 ,  H01L23/00 ,  H01L23/31

Abstract: A method of manufacturing a semiconductor package includes forming an encapsulant covering at least a portion of each of an inactive surface and side surface of a semiconductor chip, the semiconductor chip having an active surface on which a connection pad is disposed and the inactive surface opposing the active surface; forming a connection structure having a first region and a second region sequentially disposed on the active surface of the semiconductor chip, and the connection structure including a plurality of redistribution layers electrically connected to the connection pad of the semiconductor chip and further including a ground pattern layer; and forming a metal layer disposed on an upper surface of the encapsulant, and extending from the upper surface of the encapsulant to a side surface of the first region of the connection structure.

公开(公告)号：US20220325911A1

公开(公告)日：2022-10-13

申请号：US17728360

申请日：2022-04-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taeil KIM ,  Sukho LEE ,  Jejin LEE ,  Donghan KO ,  Sangho YOO ,  Dongkyu LEE ,  Jaeyang LEE ,  Changyong LEE ,  Dongil JUNG ,  Sangyoon HAN

IPC: F24F11/36 ,  F24F11/52 ,  F24F11/64

Abstract: An air conditioner including: a compressor; a heat exchanger fluidly connected to the compressor; a pressure sensor provided in a first flow path connecting an outlet of the compressor to an inlet of the first heat exchanger; a temperature sensor provided in a second flow path connected to an outlet of the heat exchanger; and a processor connected to the compressor, the pressure sensor, and the temperature sensor. The processor configured to: acquire a reference index value based on a first reference pressure measured by the pressure sensor and a first reference temperature measured by the temperature sensor, acquire a measurement index value based on a first measurement pressure measured by the pressure sensor and a first measurement temperature measured by the temperature sensor, and display a shortage of a refrigerant of the air conditioner based on the reference index value and the measurement index value.