公开(公告)号：US12191190B2

公开(公告)日：2025-01-07

申请号：US17737490

申请日：2022-05-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongmyung Jun ,  Hyunjin Ko ,  Seohyun Kim ,  Jae Seong Ryu ,  Inkwang Bae ,  Seungbu Baek

IPC: H01L21/687 ,  H01L21/67

Abstract: A substrate processing chamber includes a housing providing a process space; a spin apparatus provided in the housing; and a fluid spraying nozzle configured to spray fluid into the process space, wherein the spin apparatus includes: a spin chuck configured to support a substrate; a rotation driving part configured to rotate the spin chuck; and a weight sensor configured to measure a weight of the substrate supported on the spin chuck.