公开(公告)号：US20240379386A1

公开(公告)日：2024-11-14

申请号：US18402844

申请日：2024-01-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YONGSUK CHOI ,  Ilkyu Jeong ,  Hyunwoong Hwang ,  Kyung-Won Kang ,  Dong-Wook Kim ,  Seok Heo

IPC: H01L21/67 ,  H01L21/677

Abstract: A substrate processing system includes a cluster module having substrate processing devices, a load port through which a substrate is loaded, and a substrate cleaning device between the cluster module and the load port, the substrate cleaning device being configured to clean the substrate processed in the substrate processing devices, and the substrate cleaning device including a substrate cleaner having a cleaning chuck to support the substrate, and a cleaning nozzle configured to spray a fluid toward the cleaning chuck.