公开(公告)号：US20210113948A1

公开(公告)日：2021-04-22

申请号：US16630263

申请日：2018-08-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-woo SHIN ,  Sang-hoon LEE ,  Young-chul KO ,  Hyun-joo KIM

IPC: B01D46/00 ,  B01D46/52 ,  B01D39/20

Abstract: A filter assembly is provided. The filter assembly includes a plurality of filter modules each filled with activated carbon and continuously connected; and a frame to which the plurality of filter modules are fixed, wherein the plurality of filter modules are disposed at predetermined angles relative to each other.

公开(公告)号：US20160372412A1

公开(公告)日：2016-12-22

申请号：US15155008

申请日：2016-05-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-hoon CHOI ,  Chang-yong PARK ,  Dong-woo SHIN

IPC: H01L23/498

CPC classification number: H01L23/49838 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A package substrate includes: a body layer; and a pattern layer formed on a surface of the body layer. The pattern layer includes: a wire pattern; a solder pad connected to the wire pattern; and a through hole adjacent to a boundary between the wire pattern and the solder pad and vertically penetrating the pattern layer. A semiconductor package and an electronic device are disclosed.

Abstract translation: 封装基板包括：主体层; 以及形成在所述主体层的表面上的图案层。 图案层包括：线图案; 连接到导线图案的焊盘; 以及与导线图案和焊盘之间的边界相邻并且垂直穿透图案层的通孔。 公开了半导体封装和电子器件。