公开(公告)号：US20200010674A1

公开(公告)日：2020-01-09

申请号：US16458579

申请日：2019-07-01

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Jian WANG ,  Wei SHAN ,  Xing LIU

IPC: C08L71/12

Abstract: A thermoplastic composition includes from 29.9 wt % to 84.9 wt % of a base resin including poly(p-phenylene oxide) (PPO), polystyrene (PS) and an impact modifier; from 15 wt % to 70 wt % of a dielectric filler; and from 0.1 wt % to 10 wt % of an impact promoter including a polycarbonate-siloxane copolymer, a polyolefin-siloxane copolymer, or a combination thereof. The thermoplastic composition has a dielectric constant (Dk) of from 3.0-8.0 between 1 and 5 gigahertz (GHz) and a dissipation factor (Df) of less than 0.003 between 1 and 5 GHz. Articles including the thermoplastic composition, and in particular telecommunications devices, are also described.