公开(公告)号：US20160233204A1

公开(公告)日：2016-08-11

申请号：US15133032

申请日：2016-04-19

Applicant: Renesas Electronics Corporation

Inventor： Katsuhiko FUNATSU ,  Tomoaki UNO ,  Toru UEGURI ,  Yukihiro SATO

IPC: H01L25/00 ,  H01L21/56 ,  H01L23/00 ,  H01L21/78 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L21/683

CPC classification number: H01L25/50 ,  H01L21/4835 ,  H01L21/4839 ,  H01L21/56 ,  H01L21/561 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/49503 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/34 ,  H01L24/36 ,  H01L24/37 ,  H01L24/40 ,  H01L24/83 ,  H01L24/97 ,  H01L25/18 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/29139 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/84801 ,  H01L2224/92247 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: To improve the reliability in applying a tape to the rear surface of a substrate while securing the heat resistance of the tape applied to the rear surface of the substrate. There is a gap between a bottom surface of a ditch provided in a support member and an upper surface of a driver IC chip. On the other hand, the upper surface side of a lead frame is supported by the support member so that the bottom surface of the ditch contacts the upper surface of a Low-MOS clip mounted over a Low-MOS chip. Thus, even in a state where the driver IC chip and the Low-MOS chip are mounted on the upper surface side of the leadframe, the tape can be reliably applied to the rear surface of the lead frame (in particular, to the rear surface of the product region).

Abstract translation: 为了提高将带施加到基板的后表面上的带的可靠性，同时确保施加到基板的后表面的带的耐热性。 在支撑构件中设置的沟槽的底表面和驱动器IC芯片的上表面之间存在间隙。 另一方面，引线框架的上表面侧由支撑构件支撑，使得沟槽的底表面接触安装在低MOS芯片上的低MOS片的上表面。 因此，即使在驱动IC芯片和Low-MOS芯片安装在引线框架的上表面侧的状态下，也可以将带子可靠地施加到引线框架的后表面（特别是到后表面 的产品区域）。