公开(公告)号：US20210151330A1

公开(公告)日：2021-05-20

申请号：US16687778

申请日：2019-11-19

Applicant: QUALCOMM Incorporated

Inventor： Srikanth KULKARNI ,  Rajneesh KUMAR ,  Sayok CHATTOPADHYAY

IPC: H01L21/56 ,  H01L23/31 ,  H01L21/768 ,  H01L21/66 ,  H01L25/16

Abstract: Certain aspects of the present disclosure provide apparatus and techniques for partially molding packages for integrated circuits. A packaged assembly for integrated circuits includes: a substrate having at least one mold barrier between a first region on a first surface of the substrate and a second region on the first surface; a die attached to the substrate; one or more components attached to the substrate in the first region; and a first encapsulant over the one or more components in the first region, wherein the at least one mold barrier is configured to block a portion of the first encapsulant from moving from the first region of the substrate to the second region of the substrate during an application of the first encapsulant.