公开(公告)号：US20180066998A1

公开(公告)日：2018-03-08

申请号：US15260194

申请日：2016-09-08

Applicant: QUALCOMM Incorporated

Inventor： Ali Akbar MERRIKH ,  Martin SAINT-LAURENT ,  Mohammad GHASEMAZAR ,  Rajit CHANDRA ,  Mohamed ALLAM

IPC: G01K1/20 ,  G01K15/00 ,  G01K1/14 ,  G01K7/01

CPC classification number: G01K1/20 ,  G01K1/14 ,  G01K7/01 ,  G01K7/427 ,  G01K15/005 ,  G06F1/206 ,  Y02D10/16

Abstract: A temperature sensor position offset error correction power implementation include monitors (e.g., digital power monitor/meter) to measure activity on a die, and uses the activity measurements to compute real-time temperature offsets by converting activity to power, which can be used in a simplified compact thermal model. A system on chip including the die receives a temperature measurement of a region of the system on chip from a sensor. Power consumed by the region is estimated based on the measured activity, and temperature measurement of the system on chip is adjusted based on the estimated power.