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公开(公告)号:US11494979B2
公开(公告)日:2022-11-08
申请号:US16733231
申请日:2020-01-02
Applicant: QUALCOMM Incorporated
Inventor: Young-Ki Baik , ChaeSeong Lim , Duck Hoon Kim
Abstract: Disclosed are techniques for estimating a 3D bounding box (3DBB) from a 2D bounding box (2DBB). Conventional techniques to estimate 3DBB from 2DBB rely upon classifying target vehicles within the 2DBB. When the target vehicle is misclassified, the projected bounding box from the estimated 3DBB is inaccurate. To address such issues, it is proposed to estimate the 3DBB without relying upon classifying the target vehicle.
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公开(公告)号:US11948249B2
公开(公告)日:2024-04-02
申请号:US18045101
申请日:2022-10-07
Applicant: QUALCOMM Incorporated
Inventor: Young-Ki Baik , ChaeSeong Lim , Duck Hoon Kim
CPC classification number: G06T17/10 , G05D1/0238 , G05D1/0251 , G06T7/70 , G06T7/75 , G06T2207/10016 , G06T2207/20084 , G06T2207/30256 , G06T2207/30261 , G06T2210/12
Abstract: Disclosed are techniques for estimating a 3D bounding box (3DBB) from a 2D bounding box (2DBB). Conventional techniques to estimate 3DBB from 2DBB rely upon classifying target vehicles within the 2DBB. When the target vehicle is misclassified, the projected bounding box from the estimated 3DBB is inaccurate. To address such issues, it is proposed to estimate the 3DBB without relying upon classifying the target vehicle.
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公开(公告)号:US11508122B2
公开(公告)日:2022-11-22
申请号:US16733234
申请日:2020-01-02
Applicant: QUALCOMM Incorporated
Inventor: Young-Ki Baik , Hyun-Mook Cho , Duck Hoon Kim , Jeong-Kyun Lee , ChaeSeong Lim , Hee-Seok Lee
Abstract: Disclosed are techniques for estimating a 3D bounding box (3DBB) from a 2D bounding box (2DBB). Conventional techniques to estimate 3DBB from 2DBB rely upon classifying target vehicles within the 2DBB. When the target vehicle is misclassified, the projected bounding box from the estimated 3DBB is inaccurate. To address such issues, it is proposed to estimate the 3DBB without relying upon classifying the target vehicle.
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