公开(公告)号：US20180173659A1

公开(公告)日：2018-06-21

申请号：US15383447

申请日：2016-12-19

Applicant: QUALCOMM Incorporated

Inventor： Huibert DenBoer ,  Ari Huostila

IPC: G06F13/364 ,  G06F13/42 ,  G06F13/40 ,  G06F13/12

CPC classification number: G06F13/364 ,  G06F13/124 ,  G06F13/404 ,  G06F13/4282 ,  Y02D10/14 ,  Y02D10/151

Abstract: An electronic device is described. The electronic device includes a master integrated circuit (IC) that includes a master finite state machine (FSM). The electronic device also includes a slave IC that includes a synchronization module and a slave FSM. The electronic device further includes a control interface coupling the master IC to the slave IC. The control interface is implemented via a single wire. The master FSM communicates its states or state transitions to the synchronization module via the control interface. The synchronization module decodes the master FSM's states or state transitions and uses the decoded states or state transitions to step the slave FSM in real time such that states or state transitions in the slave FSM mirror the states or state transitions in the master FSM.