公开(公告)号：US20180083367A1

公开(公告)日：2018-03-22

申请号：US15272815

申请日：2016-09-22

Applicant: QUALCOMM Incorporated

Inventor： Young Jun SONG ,  Guining SHI ,  Allen TRAN

IPC: H01Q21/00 ,  H01Q1/48 ,  H01Q1/38 ,  H01Q1/24

CPC classification number: H01Q1/48 ,  H01Q1/243 ,  H01Q1/521 ,  H01Q5/371 ,  H01Q21/28

Abstract: A multi-antenna structure includes: a substrate; a ground plane disposed on the substrate; a signal feed mechanism; a first antenna coupled to the ground plane via the signal feed mechanism; a second antenna coupled to the ground plane via the signal feed mechanism; and an isolator electrically coupled to the ground plane and disposed between the first antenna and the second antenna, the isolator including: a first side wall and a second side wall that define a slot; a short coupled to the first side wall and to the second side wall to define a first end of the slot; and a capacitor configured and disposed to be coupled to the first side wall and to the second side wall to define a second end of the slot.