公开(公告)号：US20140227835A1

公开(公告)日：2014-08-14

申请号：US14255349

申请日：2014-04-17

Applicant: QUALCOMM INCORPORATED

Inventor： Omar James Bchir ,  Milind Pravin Shah ,  Sashidhar Movva

IPC: H01L21/56 ,  H01L23/00

CPC classification number: H01L21/563 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/92125 ,  H01L2924/01057 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A backside mold configuration (BSMC) process for manufacturing packaged integrated circuits includes applying a mold compound to a side of a packaging substrate opposite an attached die. The mold compound is deposited on a dielectric (such as photo resist). The mold compound and dielectric are patterned after coupling a die to the packaging substrate to expose a contact pad of the packaging substrate. After patterning the mold compound and dielectric, a packaging connection is coupled to contact pads through the mold compound and dielectric. The mold compound surrounding the packaging connection reduces warpage of the packaging substrate during processing. Additionally, patterning the dielectric after attaching the die improves reliability of the packaging connection.

Abstract translation: 用于制造封装集成电路的背面模具配置（BSMC）工艺包括将模具化合物施加到与附接模具相对的封装基板的一侧。 将模具化合物沉积在电介质（例如光致抗蚀剂）上。 在将模具连接到包装基板上以暴露包装基板的接触垫之后，模制化合物和电介质被图案化。 在模制化合物和电介质图案化之后，封装连接通过模具化合物和电介质耦合到接触垫。 围绕包装连接的模具化合物减少处理期间包装基材的翘曲。 此外，在连接芯片之后对电介质进行图案化提高了封装连接的可靠性。

公开(公告)号：US20150221528A9

公开(公告)日：2015-08-06

申请号：US14255349

申请日：2014-04-17

Applicant: QUALCOMM INCORPORATED

Inventor： Omar James Bchir ,  Milind Pravin Shah ,  Sashidhar Movva

IPC: H01L21/56 ,  H01L23/00

CPC classification number: H01L21/563 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/92125 ,  H01L2924/01057 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A backside mold configuration (BSMC) process for manufacturing packaged integrated circuits includes applying a mold compound to a side of a packaging substrate opposite an attached die. The mold compound is deposited on a dielectric (such as photo resist). The mold compound and dielectric are patterned after coupling a die to the packaging substrate to expose a contact pad of the packaging substrate. After patterning the mold compound and dielectric, a packaging connection is coupled to contact pads through the mold compound and dielectric. The mold compound surrounding the packaging connection reduces warpage of the packaging substrate during processing. Additionally, patterning the dielectric after attaching the die improves reliability of the packaging connection.

Abstract translation: 用于制造封装集成电路的背面模具配置（BSMC）工艺包括将模具化合物施加到与附接模具相对的封装基板的一侧。 将模具化合物沉积在电介质（例如光致抗蚀剂）上。 在将模具连接到包装基板上以暴露包装基板的接触垫之后，模制化合物和电介质被图案化。 在模制化合物和电介质图案化之后，封装连接通过模具化合物和电介质耦合到接触垫。 围绕包装连接的模具化合物减少处理期间包装基材的翘曲。 此外，在连接芯片之后对电介质进行图案化提高了封装连接的可靠性。