公开(公告)号：US10305008B2

公开(公告)日：2019-05-28

申请号：US15787408

申请日：2017-10-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takeshi Kawabata ,  Kiyomi Hagihara ,  Satoshi Kanai ,  Takashi Yui

IPC: H01L23/10 ,  H01L33/62 ,  H01L23/40 ,  H01L33/64 ,  H01L33/00 ,  H05K7/20 ,  H01L25/075

Abstract: A semiconductor module includes: one or more semiconductor elements; a wiring substrate having a first surface on which the one or more semiconductor elements are mounted, the wiring substrate being electrically connected to the one or more semiconductor elements; a heat sink on which the wiring substrate is mounted, the heat sink facing a second surface of the wiring substrate on a reverse side of the first surface; a binder which is formed in a die pad area on the heat sink so as to be present between the wiring substrate and the heat sink, and bonds the wiring substrate and the heat sink; and a support which is formed in a peripheral part of the die pad area on the heat sink, and fixes the wiring substrate to the heat sink by being in contact with a peripheral part of the second surface of the wiring substrate.