公开(公告)号：US08350373B2

公开(公告)日：2013-01-08

申请号：US13072951

申请日：2011-03-28

Applicant: Ming-Che Wu

Inventor： Ming-Che Wu

IPC: H01L23/02

CPC classification number: H01L25/50 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06551 ,  H01L2924/09701

Abstract: A chip stacked structure and method of fabricating the same are provided. The chip stacked structure includes a first chip and a second chip stacked on the first chip. The first chip has a plurality of metal pads disposed on an upper surface thereof and grooves disposed on a side surface thereof. The metal pads are correspondingly connected to upper openings of the grooves. The second chip has a plurality of grooves on a side surface of the second chip, locations of which are corresponding to that of the grooves on the side surface of the first chip. Conductive films are formed on the grooves of the first chip and the second chip and the metal pads to electronically connect the first chip and second chip. The chip stacked structure may simplify the process and improve the process yield rate.

Abstract translation: 提供了一种芯片堆叠结构及其制造方法。 芯片堆叠结构包括堆叠在第一芯片上的第一芯片和第二芯片。 第一芯片具有设置在其上表面上的多个金属焊盘和设置在其侧表面上的槽。 金属焊盘相应地连接到槽的上部开口。 第二芯片在第二芯片的侧表面上具有多个凹槽，其位置对应于第一芯片侧表面上的凹槽。 导电膜形成在第一芯片和第二芯片的沟槽和金属焊盘上以电连接第一芯片和第二芯片。 芯片堆叠结构可以简化工艺，提高工艺成品率。

公开(公告)号：US20120055640A1

公开(公告)日：2012-03-08

申请号：US12874614

申请日：2010-09-02

Applicant: Ming-Che Wu

Inventor： Ming-Che Wu

IPC: E06B9/24 ,  A47H99/00

CPC classification number: E06B9/262 ,  E06B9/266 ,  E06B9/386 ,  E06B2009/2625

Abstract: An easy curtain structure contains a curtain piece formed in a continuous curve and concave shape, allowing to be folded, including a plurality of bores disposed on a number of raised folding ribs thereof respectively in a cross arrangement, and including at least one positioning structure mounted on a top and a bottom ends thereof respectively so as to be expended and to be fixed by using the positioning structure, wherein the positioning structure includes at lease one sucker fixed on the top and the bottom ends of the curtain piece, thereby the sunshine is stopped to directly shine indoors by the continuously curved and concaved curtain piece or through the bores to obtain heatproof, anti-sun, and bright effect.

Abstract translation: 容易的帘式结构包括以连续的曲线和凹形形式形成的帘片，允许折叠，包括分布在多个布置的多个凸起的折叠肋上的多个孔，并且包括至少一个定位结构， 分别在其顶端和底端上，以便消耗并通过使用定位结构来固定，其中定位结构至少包括一个固定在帘片的顶部和底端上的吸盘，从而阳光是 停止通过连续弯曲和凹陷的窗帘或通过孔直接照射在室内，以获得耐热，防晒和明亮的效果。

公开(公告)号：US07816689B2

公开(公告)日：2010-10-19

申请号：US12216397

申请日：2008-07-03

Applicant: Ming-Che Wu

Inventor： Ming-Che Wu

IPC: H01L33/00

CPC classification number: B41J2/45

Abstract: An embedded package structure module with high-density electrical connections, including: a drive IC structure, an LED array structure and a plurality of conductive structures. The drive IC structure has at least one concave groove. The LED array structure is received in the at least one concave groove of the drive IC structure, and the LED array structure has a plurality of second open grooves formed on its lateral wall and close to the drive IC structure. The conductive structures respectively traverse the second open grooves in order to make the conductive structures electrically connect between the drive IC structure and the LED array structure.

公开(公告)号：US20090033883A1

公开(公告)日：2009-02-05

申请号：US12105509

申请日：2008-04-18

Applicant: Chung-Chin Lee ,  Ming-Che Wu ,  Chi-Hsun Huang ,  Chien-Chiu Hsueh

Inventor： Chung-Chin Lee ,  Ming-Che Wu ,  Chi-Hsun Huang ,  Chien-Chiu Hsueh

IPC: G03B21/14

CPC classification number: G03B21/206 ,  H04N9/3114 ,  H04N9/3155

Abstract: A projection apparatus includes an illuminating unit, an imaging unit, a lens unit, and a control unit. The illuminating unit includes a light source, and a light source driving module operable to drive the light source to provide an illumination beam. The imaging unit is operable so as to modulate the illumination beam into an image beam. The lens unit is disposed on an optical path of the image beam for projecting the image beam. The control unit is coupled electrically to the illuminating unit and the imaging unit. The control unit is configured to execute an activating thread for initializing the imaging unit after controlling initial driving of the light source by the light source driving module, and a monitoring thread for monitoring the light source driving module for a success signal that indicates successful provision of the illumination beam by the light source.

Abstract translation: 投影设备包括照明单元，成像单元，透镜单元和控制单元。 照明单元包括光源，以及可操作以驱动光源以提供照明光束的光源驱动模块。 成像单元可操作以将照明光束调制成图像束。 透镜单元设置在用于投影图像束的图像束的光路上。 控制单元电耦合到照明单元和成像单元。 控制单元被配置为在由光源驱动模块控制光源的初始驱动之后执行用于初始化成像单元的激活线程，以及用于监视成功信号的光源驱动模块的监视线程，该成功信号指示成功提供 光源照明光束。

公开(公告)号：US07357392B1

公开(公告)日：2008-04-15

申请号：US11714548

申请日：2007-03-06

Applicant: Ming-Che Wu

Inventor： Ming-Che Wu

IPC: A63F7/07

CPC classification number: A63F7/3603 ,  A63F7/0632 ,  A63F2009/0087 ,  A63F2250/0428

Abstract: A hockey table includes a table body, a top board mounted on a top of the table body and formed with a plurality of ventilating holes, and an atomizer mounted in the table body to spray an atomized gas which passes through the ventilating holes of the top board and protrudes outwardly from the top board. Thus, the atomized gas encompasses the top board to simulate a real and lively scene for the players to play the table hockey game, thereby enhancing the amusement effect of playing the hockey.

Abstract translation: 曲棍球台包括台体，顶板安装在桌面的顶部并形成有多个通风孔，以及安装在桌子主体中的雾化器，用于喷射通过顶部通风孔的雾化气体 并从顶板向外突出。 因此，雾化的气体包括顶板，以模拟一个真实而活泼的场景，让玩家玩桌上曲棍球比赛，从而提高了曲棍球的娱乐效果。

公开(公告)号：US20080015039A1

公开(公告)日：2008-01-17

申请号：US11488100

申请日：2006-07-17

Applicant: Ming-Che Wu

Inventor： Ming-Che Wu

IPC: A63D15/00

CPC classification number: A63D15/00

Abstract: A bottom board for a playing table includes a board body, at least one anti-slip cloth layer enclosed around the board body entirely, and at least one fiber cloth layer enclosed around the anti-slip cloth layer entirely. Each of the board body, the anti-slip cloth layer and the fiber cloth layer has a surface sprayed with a resin layer. Thus, the bottom board has a reinforced hardness, so that the bottom board will not be dimpled due to a violent hit, thereby enhancing the lifetime of the bottom board. In addition, the bottom board is formed integrally and has a smaller volume and a light weight, thereby facilitating assembly, transportation and storage of the bottom board. Further, the bottom board has a waterproof feature so that the bottom board can be used outdoors.

Abstract translation: 用于演奏桌的底板包括板体，至少一个围绕板体整体封闭的防滑布层，以及至少一个围绕防滑布层围绕的纤维布层。 板体，防滑布层和纤维布层中的每一个具有被树脂层喷射的表面。 因此，底板具有增强的硬度，使得底板由于剧烈撞击而不会变形，从而增加底板的寿命。 此外，底板一体地形成并且具有较小的体积和重量轻，从而便于底板的组装，运输和储存。 此外，底板具有防水特征，使得底板可以在室外使用。

公开(公告)号：US08813354B2

公开(公告)日：2014-08-26

申请号：US13195087

申请日：2011-08-01

Applicant: Ming-Che Wu

Inventor： Ming-Che Wu

IPC: H05K3/30 ,  H05K9/00 ,  H01L23/552 ,  H01L25/065

CPC classification number: H05K9/003 ,  H01L23/552 ,  H01L25/0655 ,  H01L2924/0002 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49227 ,  H01L2924/00

Abstract: An electromagnetic interference (EMI) shielding structure, which includes: a substrate, at least one chip unit, a packing layer, and an EMI shielding unit. The chip unit is disposed on the surface of the substrate and electrically coupled thereto. The packing layer is formed on the substrate and covers the chip unit. The EMI shielding unit includes: a first, second, and third shielding layer. The first shielding layer covers the outer surface of the packing layer and the lateral surface of the substrate. The second and third shielding layer respectively covers the outer surface of the first and second shielding layer. Based on the instant disclosure, the EMI shielding unit uses the methods of sputtering and electroless plating, to increase the adhesion strength of the EMI shielding unit and make the thickness of the shielding layer uniform. The instant disclosure raises the EMI shielding efficiency and lowers the manufacturing cost.

Abstract translation: 一种电磁干扰（EMI）屏蔽结构，其包括：衬底，至少一个芯片单元，封装层和EMI屏蔽单元。 芯片单元设置在基板的表面上并与其电耦合。 填充层形成在基板上并覆盖芯片单元。 EMI屏蔽单元包括：第一，第二和第三屏蔽层。 第一屏蔽层覆盖填料层的外表面和基材的侧表面。 第二和第三屏蔽层分别覆盖第一和第二屏蔽层的外表面。 基于本公开，EMI屏蔽单元使用溅射和化学镀的方法来增加EMI屏蔽单元的粘合强度并使屏蔽层的厚度均匀。 本公开提出了EMI屏蔽效率并降低了制造成本。

公开(公告)号：US08342707B2

公开(公告)日：2013-01-01

申请号：US12071112

申请日：2008-02-15

Applicant: Ming-Che Wu

Inventor： Ming-Che Wu

IPC: F21V9/00

CPC classification number: B41J2/45 ,  H01L24/24 ,  H01L24/73 ,  H01L24/82 ,  H01L25/167 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/10157 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A multi-wavelength light-emitting module that includes a PCB, a drive IC structure, a conductive structure, a multi-wavelength LED array set, a plurality of conductive elements, and an optical amplifier structure. The PCB has at least one input/output pad. The drive IC structure is disposed on the PCB and having at least one concave groove formed on top surface thereof. The conductive structure is electrically connected between the drive IC structure and the at least one input/output pad. The multi-wavelength LED array set is received in the at least one concave groove. The conductive elements are electrically connected between drive IC structure and the multi-wavelength LED array set, respectively. The optical amplifier structure is disposed over the multi-wavelength LED array set for receiving light sources from the multi-wavelength LED array set.

公开(公告)号：US07759687B2

公开(公告)日：2010-07-20

申请号：US12003689

申请日：2007-12-31

Applicant: Ming-Che Wu

Inventor： Ming-Che Wu

IPC: H01L29/20

CPC classification number: B41J2/45

Abstract: A method for packaging a multi-wavelength LED array package module includes: forming at least one concave groove on a drive IC structure; arranging a multi-wavelength LED array set in the at least one concave groove; solidifying a plurality of liquid conductive materials to form a plurality of conductive elements that is electrically connected between the drive IC structure and the multi-wavelength LED array set by a printing, a coating, a stamping, or a stencil printing process; arranging the drive IC structure on a PCB with at least one input/output pad; and then forming a conductive structure that is electrically connected between the drive IC structure and the at least one input/output pad.

Abstract translation: 一种用于封装多波长LED阵列封装模块的方法包括：在驱动IC结构上形成至少一个凹槽; 布置在所述至少一个凹槽中的多波长LED阵列; 固化多个液体导电材料以形成电连接在驱动IC结构和通过印刷，涂层，冲压或模版印刷工艺组合的多波长LED阵列之间的多个导电元件; 将驱动IC结构布置在具有至少一个输入/输出垫的PCB上; 然后形成电连接在驱动IC结构和至少一个输入/输出焊盘之间的导电结构。

公开(公告)号：US20100001295A1

公开(公告)日：2010-01-07

申请号：US12216397

申请日：2008-07-03

Applicant: Ming-Che Wu

Inventor： Ming-Che Wu

IPC: H01L33/00

CPC classification number: B41J2/45

Abstract: An embedded package structure module with high-density electrical connections, including: a drive IC structure, an LED array structure and a plurality of conductive structures. The drive IC structure has at least one concave groove. The LED array structure is received in the at least one concave groove of the drive IC structure, and the LED array structure has a plurality of second open grooves formed on its lateral wall and close to the drive IC structure. The conductive structures respectively traverse the second open grooves in order to make the conductive structures electrically connect between the drive IC structure and the LED array structure.

Abstract translation: 一种具有高密度电连接的嵌入式封装结构模块，包括：驱动IC结构，LED阵列结构和多个导电结构。 驱动IC结构具有至少一个凹槽。 LED阵列结构被容纳在驱动IC结构的至少一个凹槽中，并且LED阵列结构具有形成在其侧壁上且靠近驱动IC结构的多个第二开放槽。 导电结构分别穿过第二开槽，以使导电结构在驱动IC结构和LED阵列结构之间电连接。