Abstract:
An exemplary decoding method of an input video bitstream including a first bitstream and a second bitstream includes: decoding a first picture in the first bitstream; after a required decoded data derived from decoding the first picture is ready for a first decoding operation of a second picture in the first bitstream, performing the first decoding operation; and after a required decoded data derived from decoding the first picture is ready for a second decoding operation of a picture in the second bitstream, performing the second decoding operation, wherein a time period of decoding the second picture in the first bitstream and a time period of decoding the picture in the second bitstream are overlapped in time.
Abstract:
An integrated circuit chip includes a semiconductor substrate; a first interconnection wire having a first portion and a second portion on the semiconductor substrate, wherein the second portion is separated from the first portion; a second interconnection wire situated under the first interconnection wire; a first conductive via electrically coupling the first portion with the second interconnection wire; a conductive layer situated between the first interconnection wire and the second interconnection wire; and a second conductive via electrically coupling the conductive layer with the second portion.
Abstract:
An exemplary decoding method of an input video bitstream including a first bitstream and a second bitstream includes: decoding a first picture in the first bitstream; after a required decoded data derived from decoding the first picture is ready for a first decoding operation of a second picture in the first bitstream, performing the first decoding operation; and after a required decoded data derived from decoding the first picture is ready for a second decoding operation of a picture in the second bitstream, performing the second decoding operation, wherein a time period of decoding the second picture in the first bitstream and a time period of decoding the picture in the second bitstream are overlapped in time.
Abstract:
An integrated circuit chip includes a semiconductor substrate; a first interconnection wire having a first portion and a second portion on the semiconductor substrate, wherein the second portion is separated from the first portion; a second interconnection wire situated under the first interconnection wire; a first conductive via electrically coupling the first portion with the second interconnection wire; a conductive layer situated between the first interconnection wire and the second interconnection wire; and a second conductive via electrically coupling the conductive layer with the second portion.