Invention Grant
- Patent Title: Integrated circuit chip with reduced IR drop
- Patent Title (中): 集成电路芯片具有降低的IR降
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Application No.: US13907981Application Date: 2013-06-03
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Publication No.: US08766417B2Publication Date: 2014-07-01
- Inventor: Chao-Chun Tu , Shih-Hung Lin , Chih-Chien Huang , Tien-Chang Chang
- Applicant: Mediatek Inc.
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: Mediatek Inc.
- Current Assignee: Mediatek Inc.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00 ; H01L49/02 ; H01L27/00 ; H01L21/00
Abstract:
An integrated circuit chip includes a semiconductor substrate; a first interconnection wire having a first portion and a second portion on the semiconductor substrate, wherein the second portion is separated from the first portion; a second interconnection wire situated under the first interconnection wire; a first conductive via electrically coupling the first portion with the second interconnection wire; a conductive layer situated between the first interconnection wire and the second interconnection wire; and a second conductive via electrically coupling the conductive layer with the second portion.
Public/Granted literature
- US20130264681A1 INTEGRATED CIRCUIT CHIP WITH REDUCED IR DROP Public/Granted day:2013-10-10
Information query
IPC分类:
