公开(公告)号：US20240196539A1

公开(公告)日：2024-06-13

申请号：US18533234

申请日：2023-12-08

Applicant: MEDIATEK INC.

Inventor： Chun-Ping Chen ,  Pei-San Chen ,  Hui-Chi Tang

IPC: H05K1/18 ,  H01L23/00 ,  H01L23/498 ,  H01L25/16

CPC classification number: H05K1/183 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L25/16 ,  H01L2224/13005 ,  H01L2224/16227 ,  H01L2924/2076 ,  H05K1/021 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10734

Abstract: A printed circuit board assembly including a substrate having a first surface and a second surface opposite to the first surface, wherein the substrate has a first thickness; a cavity disposed within a chip module mounting region of the substrate on the first surface that caves in towards the second surface, wherein the chip module mounting region of the substrate has a second thickness, wherein the second thickness is smaller than the first thickness; a plurality of bonding pads in the cavity; and a chip module mounted in the cavity and electrically connected to the substrate through the plurality of bonding pads.