公开(公告)号：US10397142B2

公开(公告)日：2019-08-27

申请号：US15050473

申请日：2016-02-23

Applicant: MEDIATEK INC.

Inventor： Yan-Bin Luo ,  Hao-Hui Yin ,  Chih-Ching Yu ,  Yao-Chun Su

IPC: H03M9/00 ,  H04L12/931 ,  H04L12/935 ,  H01L25/065 ,  H01L25/18

Abstract: A multi-chip structure comprises a switch system on chip (switch SOC), a plurality of serializer/deserializer (SerDes) chips positioned around the switch SOC, and a plurality of inter-chip interfaces for connecting the switch SOC to the plurality of SerDes chips, respectively.

公开(公告)号：US20170054656A1

公开(公告)日：2017-02-23

申请号：US15050473

申请日：2016-02-23

Applicant: MEDIATEK INC.

Inventor： Yan-Bin Luo ,  Hao-Hui Yin ,  Chih-Ching Yu ,  Yao-Chun Su

IPC: H04L12/931 ,  H04L12/935

CPC classification number: H04L49/40 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15192 ,  H01L2924/15311 ,  H03M9/00 ,  H04L49/30

Abstract: A multi-chip structure comprises a switch system on chip (switch SOC), a plurality of serializer/deserializer (SerDes) chips positioned around the switch SOC, and a plurality of inter-chip interfaces for connecting the switch SOC to the plurality of SerDes chips, respectively.

Abstract translation: 多芯片结构包括片上开关系统（开关SOC），位于开关SOC周围的多个串行器/解串器（SerDes）芯片，以及用于将开关SOC连接到多个SerDes的多个芯片间接口 芯片。