公开(公告)号：US20160359295A1

公开(公告)日：2016-12-08

申请号：US14731510

申请日：2015-06-05

Applicant: Lumentum Operations LLC

Inventor： Kong Weng LEE ,  Vincent V. WONG ,  Jay A. SKIDMORE ,  Jihua DU

IPC: H01S5/022 ,  H01S5/024

CPC classification number: H01S5/02272 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01S5/022 ,  H01S5/02236 ,  H01S5/02256 ,  H01S5/02268 ,  H01S5/02276 ,  H01S5/02296 ,  H01S5/02469 ,  H01S5/02476 ,  H01L2924/00014

Abstract: A chip-scale package for an edge-emitting semiconductor device and a semiconductor device assembly including such a chip-scale package are provided. The chip-scale package includes an edge-emitting semiconductor device chip, a top submount disposed on a top surface of the chip, and a bottom submount disposed on a bottom surface of the chip. The top-submount area and the bottom-submount area are each greater than the chip area and less than or equal to about 1.2 times the chip area.

Abstract translation: 提供了一种用于边缘发射半导体器件和包括这种芯片级封装的半导体器件组件的芯片级封装。 芯片级封装包括边缘发射半导体器件芯片，设置在芯片的顶表面上的顶部基座和设置在芯片的底表面上的底部基座。 顶部底座区域和底部底座区域各自大于芯片面积，小于或等于芯片面积的约1.2倍。