公开(公告)号：US20190037725A1

公开(公告)日：2019-01-31

申请号：US16040317

申请日：2018-07-19

申请人： LENOVO (SINGAPORE) PTE. LTD.

发明人： Akinori Uchino ,  Kazuo Fujii ,  Takuroh Kamimura ,  Kenji Watamura ,  Hiroshi Yamazaki ,  Takanori Hoshino

IPC分类号： H05K7/20 ,  G06F1/16 ,  H05K5/03

摘要： An electronic apparatus is provided. The electronic apparatus includes a main body chassis equipped with a keyboard device, a CPU, a heat diffusion component and a heat transport component. The CPU is disposed on a rear end side beyond the keyboard device. The heat diffusion component is disposed at a position located under the keyboard device in a mutually superposed state. The heat transport component is connected between the CPU and the heat diffusion component to provide heat transfer.

公开(公告)号：US20230121174A1

公开(公告)日：2023-04-20

申请号：US17943429

申请日：2022-09-13

申请人： Lenovo (Singapore) Pte. Ltd.

发明人： Atsushi Ohyama ,  Yusuke Onoue ,  Takanori Hoshino

IPC分类号： G06F1/16 ,  G09F9/30 ,  G06F1/20

摘要： An electronic apparatus includes: a first chassis equipped with a substrate on which a processing device is mounted; a second chassis which is provided adjacently to the first chassis and equipped with a battery device; a hinge device that connects the first chassis and the second chassis in such a manner as to be rotatable relative to each other between a first posture in which the first chassis and the second chassis are stacked to overlap each other in a surface normal direction and a second posture in which the first chassis and the second chassis are arranged side by side in a direction perpendicular in the surface normal direction; a spine component which is made of a thermally conductive material.

公开(公告)号：US10546799B2

公开(公告)日：2020-01-28

申请号：US16040317

申请日：2018-07-19

申请人： LENOVO (SINGAPORE) PTE. LTD.

发明人： Akinori Uchino ,  Kazuo Fujii ,  Takuroh Kamimura ,  Kenji Watamura ,  Hiroshi Yamazaki ,  Takanori Hoshino

IPC分类号： G06F1/16 ,  H01L23/427 ,  G06F1/20 ,  G06F1/18

摘要： An electronic apparatus is provided. The electronic apparatus includes a main body chassis equipped with a keyboard device, a CPU, a heat diffusion component and a heat transport component. The CPU is disposed on a rear end side beyond the keyboard device. The heat diffusion component is disposed at a position located under the keyboard device in a mutually superposed state. The heat transport component is connected between the CPU and the heat diffusion component to provide heat transfer.