公开(公告)号：US10515737B2

公开(公告)日：2019-12-24

申请号：US15799810

申请日：2017-10-31

Applicant: Korea Electronics Technology Institute

Inventor： Sung Hyun Kim ,  Ji Sun Park ,  Myong Jae Yoo

IPC: H01B1/22 ,  H05K1/09 ,  C09D5/24 ,  C08K3/38 ,  C08K3/08 ,  H01L31/0224

Abstract: A conductive paste composition, a method for preparing the same, and an electrode formed by the conductive paste composition are disclosed. In one aspect, the conductive paste composition includes a copper-based particle and a boron-based particle of which a surface is partially or entirely coated with boron oxide. The boron-based particle is crystalline boron-based particle or amorphous boron-based particle. The boron-based particle has a content of more than 1 wt % to less than 10 wt % based on a total content of the conductive paste composition.

公开(公告)号：US20190115117A1

公开(公告)日：2019-04-18

申请号：US15799810

申请日：2017-10-31

Applicant: Korea Electronics Technology Institute

Inventor： Sung Hyun Kim ,  Ji Sun Park ,  Myong Jae Yoo

IPC: H01B1/22 ,  H01L31/0224

Abstract: A conductive paste composition, a method for preparing the same, and an electrode formed by the conductive paste composition are disclosed. In one aspect, the conductive paste composition includes a copper-based particle and a boron-based particle of which a surface is partially or entirely coated with boron oxide. The boron-based particle is crystalline boron-based particle or amorphous boron-based particle. The boron-based particle has a content of more than 1 wt % to less than 10 wt % based on a total content of the conductive paste composition.