公开(公告)号：US20250076132A1

公开(公告)日：2025-03-06

申请号：US18773684

申请日：2024-07-16

Applicant: Korea Advanced Institute of Science and Technology

Inventor： Seong Su KIM ,  Won Vin KIM ,  Seong Yeon PARK ,  Seung Yoon ON

IPC: G01L1/22 ,  G01K7/16

Abstract: A dual-mode coaxial fiber sensor has a structure in which a core fiber, a strain sensing layer formed on the core fiber and made of a conductive material, and a temperature sensing layer formed on the surface of the strain sensing layer and made of a conductive material are stacked, thereby simultaneously measuring a temperature and a strain using one sensor.

公开(公告)号：US20240375327A1

公开(公告)日：2024-11-14

申请号：US18635084

申请日：2024-04-15

Applicant: Korea Advanced Institute of Science and Technology

Inventor： Seong Su KIM ,  Seong Yeon PARK ,  Seung Yoon ON

IPC: B29C43/58 ,  B29C35/02 ,  B29C37/00 ,  B29C43/18 ,  B29C43/52 ,  B29K63/00 ,  B29K105/16 ,  B29K509/00 ,  B29L31/34 ,  H01L21/56

Abstract: An electronic package molding device includes a planar heating element configured to mold an electronic package by approaching one surface of an electronic package to melt a molding agent disposed on the one surface of the electronic package and apply pressure to bring the epoxy molding compound into close contact with the electronic package and a gas pressure regulator configured to adjust gas pressure between the electronic package and the planar heating element.