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公开(公告)号:US20190225819A1
公开(公告)日:2019-07-25
申请号:US16057582
申请日:2018-08-07
Inventor: KyoungWook PAIK , Dal Jin YOON
IPC: C09D5/24 , B05D1/28 , C09J7/24 , C09J9/02 , C09D133/20
Abstract: Disclosed are a self-exposure method for a surface of conductive particles anchored in a polymer layer, a method of fabricating an anisotropic conductive film using the self-exposure method, and the anisotropic conductive film. A self-exposure method for a surface of conductive particles within a polymer layer may include controlling surface energy of multiple conductive particles so that a difference between surface energy of polymer to be used to fabricate the polymer layer and surface energy of the multiple conductive particles to be included in the polymer layer is a preset difference or more, forming a polymer solution by dissolving the polymer into a solvent in which the conductive particles having controlled surface energy have been mixed, and generating the polymer layer from which at least part of a surface of the multiple conductive particles has been externally exposed due to a difference in the surface energy by drying the polymer solution.
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公开(公告)号:US20200239651A1
公开(公告)日:2020-07-30
申请号:US16421957
申请日:2019-05-24
Inventor: KyoungWook PAIK , Dal-Jin YOON , Junho BYEON
Abstract: Disclosed are a method of uniformly dispersing nickel-plated conductive particles of a single layer within a polymer film by applying a magnetic field to the polymer film and a method of fabricating an anisotropic conductive film using the same. The method of fabricating a film may include forming a liquefied polymer layer by roll-to-roll coating a polymer solution in which a plurality of conductive particles has been mixed, dispersing the plurality of conductive particles included in the liquefied polymer layer by applying a magnetic field to the liquefied polymer layer, and fabricating a solid polymer layer limiting a movement of the plurality of dispersed conductive particles by drying the liquefied polymer layer in which the plurality of conductive particles has been dispersed.
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公开(公告)号:US20210261829A1
公开(公告)日:2021-08-26
申请号:US16951466
申请日:2020-11-18
Inventor: KyoungWook PAIK , Jae Hyeong PARK
Abstract: Disclosed are an anisotropic conductive adhesives for thermo-compression bonding containing solder conductive particles and flux aciditives and a method of connecting electronic parts using the same. The anisotropic conductive adhesives for thereto-compression bonding may include a flux activator, solder particles and polymer resin.
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