公开(公告)号：US20160329676A1

公开(公告)日：2016-11-10

申请号：US15109090

申请日：2015-02-11

Applicant: KOREA ELECTRONICS TECHNOLOGY INSTITUTE

Inventor： Hyung Man LEE ,  Soon Seob PARK

IPC: H01S3/02 ,  H01S3/094 ,  H01S3/0941

CPC classification number: H01S3/025 ,  G02B7/18 ,  H01S3/0092 ,  H01S3/061 ,  H01S3/094003 ,  H01S3/094038 ,  H01S3/0941 ,  H01S3/09415

Abstract: The present invention relates to a method for manufacturing a laser module, and a laser module package, and the method for manufacturing a laser module. Rapidity, accuracy and high reliability of the manufactured module can be obtained by aligning precisely using an automated equipment, and fixing components through laser welding.

Abstract translation: 本发明涉及一种激光模块的制造方法，激光模块封装以及激光模块的制造方法。 通过精确地使用自动化设备和通过激光焊接固定部件可以获得制造的模块的快速性，准确度和高可靠性。