CURABLE SILOXANE RESIN COMPOSITION

    公开(公告)号:US20230078587A1

    公开(公告)日:2023-03-16

    申请号:US17726742

    申请日:2022-04-22

    Abstract: Provided is a curable siloxane composition with low dielectric constant and low dielectric loss, in which organic alkoxy silane having a silicon-based asymmetric structure and organic alkoxy silane having a silicon-based symmetric structure are included. The curable siloxane composition has low dielectric constant and dielectric loss in a high frequency range, low water absorption, excellent workability, and high copper foil peel strength, and thus physical properties suitable for application to printed circuit boards for high-frequency communication electronic devices may be provided.

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