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公开(公告)号:US10544359B2
公开(公告)日:2020-01-28
申请号:US15917956
申请日:2018-03-12
Inventor: Byeong-Soo Bae , Hwea Yoon Kim , Junho Jang
IPC: H01B1/08 , C09K11/02 , C08G77/52 , C09K11/54 , H01L33/50 , H01L33/56 , C09K11/70 , C09K11/56 , C09K11/88 , C08L83/04 , C08G77/00 , C08G77/20
Abstract: The present invention relates to a method for preparing a semiconductor nanocrystal siloxane composite resin composition, and a cured product using the same. In the preparation method, the semiconductor nanocrystals are added during a non-hydrolytic sol-gel condensation reaction for forming a siloxane structure so that a siloxane resin having a dense inorganic network, which includes a siloxane bond, is encapsulated and thus is dispersed in the semiconductor nanocrystals through a chemical interaction and a chemical bond, thereby preventing a reduction in inherent characteristics (quantum efficiency) of the semiconductor nanocrystals resulting from an external oxidizing environment. Accordingly, when the curing of the resin composition is carried out, a cured product, which can be applied to various applications including a semiconductor nanocrystal siloxane composite having excellent reliability, can be provided.
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公开(公告)号:US20180273838A1
公开(公告)日:2018-09-27
申请号:US15917956
申请日:2018-03-12
Inventor: Byeong-Soo BAE , Hwea Yoon Kim , Junho Jang
Abstract: The present invention relates to a method for preparing a semiconductor nanocrystal siloxane composite resin composition, and a cured product using the same. In the preparation method, the semiconductor nanocrystals are added during a non-hydrolytic sol-gel condensation reaction for forming a siloxane structure so that a siloxane resin having a dense inorganic network, which includes a siloxane bond, is encapsulated and thus is dispersed in the semiconductor nanocrystals through a chemical interaction and a chemical bond, thereby preventing a reduction in inherent characteristics (quantum efficiency) of the semiconductor nanocrystals resulting from an external oxidizing environment. Accordingly, when the curing of the resin composition is carried out, a cured product, which can be applied to various applications including a semiconductor nanocrystal siloxane composite having excellent reliability, can be provided.
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