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公开(公告)号：US10529951B2
公开(公告)日：2020-01-07
申请号：US16101583
申请日：2018-08-13
Inventor： Kyung Cheol Choi , Jeong Hyun Kwon
Abstract: Provided is an encapsulation structure for a transparent flexible organic electronic device, the encapsulation structure including a flexible substrate, and at least one hybrid unit structure provided on at least one surface of the flexible substrate and including a zinc oxide thin film, an aluminum oxide thin film, and a magnesium oxide thin film stacked on one another.
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