公开(公告)号：US20140193065A1

公开(公告)日：2014-07-10

申请号：US13737677

申请日：2013-01-09

Applicant: KLA-TENCOR CORPORATION ,  Carmela Moreno

Inventor： Xing Chu ,  Jan A. Lauber ,  J. Rex Runyon

IPC: G06T7/00

CPC classification number: G06T7/0004 ,  G06T2207/20012 ,  G06T2207/30148 ,  H01L22/12 ,  H01L22/20

Abstract: Various embodiments for detecting defects on a wafer are provided. Some embodiments include matching a template image, in which at least some pixels are associated with regions in the device having different characteristics, to output of an electron beam inspection system and applying defect detection parameters to pixels in the output based on the regions that the pixels in the output are located within to thereby detect defects on the wafer.

Abstract translation: 提供了用于检测晶片上的缺陷的各种实施例。 一些实施例包括使至少一些像素与具有不同特征的设备中的区域相关联的模板图像匹配到电子束检查系统的输出并且将缺陷检测参数应用于输出中的像素，基于像素 在输出端位于其内，从而检测晶片上的缺陷。

公开(公告)号：US09293298B2

公开(公告)日：2016-03-22

申请号：US14528941

申请日：2014-10-30

Applicant: KLA-Tencor Corporation

Inventor： Jan A. Lauber

IPC: H01J37/26 ,  G01N23/22 ,  G01N23/00 ,  G01N21/00

CPC classification number: H01J37/261 ,  H01J2237/2817 ,  H01L22/12 ,  H01L22/20

Abstract: Various embodiments for classifying defects detected on a wafer are provided. One method includes acquiring an electron beam image generated by a defect review tool for a location of a defect detected on a wafer by a wafer inspection tool. The method also includes determining a classification of the defect based on at least the electron beam image and without input from a user. The method may also include feeding back the classification results to the wafer inspection tool and optimizing the parameters of the tool to maximize sensitivity to the defects of interest.

Abstract translation: 提供了用于分类在晶片上检测到的缺陷的各种实施例。 一种方法包括获取由缺陷检查工具生成的电子束图像，用于通过晶片检查工具在晶片上检测到的缺陷的位置。 该方法还包括至少基于电子束图像确定缺陷的分类，并且不需要来自用户的输入。 该方法还可以包括将分类结果反馈到晶片检查工具并优化工具的参数以使对感兴趣缺陷的敏感度最大化。

公开(公告)号：US20150179400A1

公开(公告)日：2015-06-25

申请号：US14528941

申请日：2014-10-30

Applicant: KLA-Tencor Corporation

Inventor： Jan A. Lauber

IPC: H01J37/26

CPC classification number: H01J37/261 ,  H01J2237/2817 ,  H01L22/12 ,  H01L22/20

Abstract: Various embodiments for classifying defects detected on a wafer are provided. One method includes acquiring an electron beam image generated by a defect review tool for a location of a defect detected on a wafer by a wafer inspection tool. The method also includes determining a classification of the defect based on at least the electron beam image and without input from a user. The method may also include feeding back the classification results to the wafer inspection tool and optimizing the parameters of the tool to maximize sensitivity to the defects of interest.

Abstract translation: 提供了用于分类在晶片上检测到的缺陷的各种实施例。 一种方法包括获取由缺陷检查工具生成的电子束图像，用于通过晶片检查工具在晶片上检测到的缺陷的位置。 该方法还包括至少基于电子束图像确定缺陷的分类，并且不需要来自用户的输入。 该方法还可以包括将分类结果反馈到晶片检查工具并优化工具的参数以使对感兴趣缺陷的敏感度最大化。

公开(公告)号：US09311698B2

公开(公告)日：2016-04-12

申请号：US13737677

申请日：2013-01-09

Applicant: KLA-Tencor Corporation ,  Carmela Moreno

Inventor： Xing Chu ,  Jan A. Lauber ,  J. Rex Runyon

IPC: G06T7/00 ,  H01L21/66

CPC classification number: G06T7/0004 ,  G06T2207/20012 ,  G06T2207/30148 ,  H01L22/12 ,  H01L22/20

Abstract: Various embodiments for detecting defects on a wafer are provided. Some embodiments include matching a template image, in which at least some pixels are associated with regions in the device having different characteristics, to output of an electron beam inspection system and applying defect detection parameters to pixels in the output based on the regions that the pixels in the output are located within to thereby detect defects on the wafer.

Abstract translation: 提供了用于检测晶片上的缺陷的各种实施例。 一些实施例包括使至少一些像素与具有不同特征的设备中的区域相关联的模板图像匹配到电子束检查系统的输出并且将缺陷检测参数应用于输出中的像素，基于像素 在输出端位于其内，从而检测晶片上的缺陷。