公开(公告)号：US20180144996A1

公开(公告)日：2018-05-24

申请号：US15813004

申请日：2017-11-14

Applicant: KLA-Tencor Corporation

Inventor： David Craig Oram ,  Abhinav Mathur ,  Kenong Wu ,  Eugene Shifrin

IPC: H01L21/66 ,  H01L21/67 ,  G01N21/88 ,  G01N21/95

CPC classification number: H01L22/12 ,  G01N21/8806 ,  G01N21/9501 ,  G01N2021/8825 ,  G01N2021/8848 ,  G01N2021/8883 ,  H01L21/67288 ,  H01L22/20

Abstract: A system, method, and non-transitory computer readable medium are provided for tuning sensitivities of, and determining a process window for, a modulated wafer. The sensitivities for dies of the modulated wafer are tuned dynamically based on a single set of parameters. Further, the process window is determined for the modulated wafer from prior determined parameter-specific nominal process windows.

公开(公告)号：US11139216B2

公开(公告)日：2021-10-05

申请号：US16862348

申请日：2020-04-29

Applicant: KLA-Tencor Corporation

Inventor： David Craig Oram ,  Abhinav Mathur ,  Kenong Wu ,  Eugene Shifrin

IPC: H01L21/66 ,  G01N21/88 ,  H01L21/67 ,  G01N21/95

Abstract: A system, method, and non-transitory computer readable medium are provided for tuning sensitivities of, and determining a process window for, a modulated wafer. The sensitivities for dies of the modulated wafer are tuned dynamically based on a single set of parameters. Further, the process window is determined for the modulated wafer from prior determined parameter-specific nominal process windows.

公开(公告)号：US20200258792A1

公开(公告)日：2020-08-13

申请号：US16862348

申请日：2020-04-29

Applicant: KLA-Tencor Corporation

Inventor： David Craig Oram ,  Abhinav Mathur ,  Kenong Wu ,  Eugene Shifrin

IPC: H01L21/66 ,  H01L21/67 ,  G01N21/88

Abstract: A system, method, and non-transitory computer readable medium are provided for tuning sensitivities of, and determining a process window for, a modulated wafer. The sensitivities for dies of the modulated wafer are tuned dynamically based on a single set of parameters. Further, the process window is determined for the modulated wafer from prior determined parameter-specific nominal process windows.

公开(公告)号：US10679909B2

公开(公告)日：2020-06-09

申请号：US15813004

申请日：2017-11-14

Applicant: KLA-Tencor Corporation

Inventor： David Craig Oram ,  Abhinav Mathur ,  Kenong Wu ,  Eugene Shifrin

IPC: H01L21/66 ,  G01N21/88 ,  H01L21/67 ,  G01N21/95

Abstract: A system, method, and non-transitory computer readable medium are provided for tuning sensitivities of, and determining a process window for, a modulated wafer. The sensitivities for dies of the modulated wafer are tuned dynamically based on a single set of parameters. Further, the process window is determined for the modulated wafer from prior determined parameter-specific nominal process windows.