公开(公告)号：US09939386B2

公开(公告)日：2018-04-10

申请号：US13779062

申请日：2013-02-27

Applicant: KLA-Tencor Corporation

Inventor： Isabella T. Lewis ,  Yakov Bobrov

IPC: G01N21/88 ,  G01N21/95

CPC classification number: G01N21/8806 ,  G01N21/9501 ,  G01N2021/8845

Abstract: The disclosure is directed to systems and methods for sample inspection and review. In some embodiments, images are collected and/or defects are located utilizing separately addressable red, green, and blue (RGB) illumination sources to improve image quality. In some embodiments, illumination sources are pulse width modulated for substantially consistent light intensity in presence of variable sample motion. In some embodiments, a stage assembly is configured to support the sample without blocking access to the supported surface of the sample, and further configured to reduce oscillations or vibrations of the sample. In some embodiments, an illumination system includes an imaging path and a focusing path to allow full field of view focusing.

公开(公告)号：US20130271596A1

公开(公告)日：2013-10-17

申请号：US13779062

申请日：2013-02-27

Applicant: KLA-TENCOR CORPORATION

Inventor： Isabella T. Lewis ,  Yakov Bobrov

IPC: G01N21/88

CPC classification number: G01N21/8806 ,  G01N21/9501 ,  G01N2021/8845

Abstract: The disclosure is directed to systems and methods for sample inspection and review. In some embodiments, images are collected and/or defects are located utilizing separately addressable red, green, and blue (RGB) illumination sources to improve image quality. In some embodiments, illumination sources are pulse width modulated for substantially consistent light intensity in presence of variable sample motion. In some embodiments, a stage assembly is configured to support the sample without blocking access to the supported surface of the sample, and further configured to reduce oscillations or vibrations of the sample. In some embodiments, an illumination system includes an imaging path and a focusing path to allow full field of view focusing.

Abstract translation: 本公开涉及用于样品检查和检查的系统和方法。 在一些实施例中，利用单独可寻址的红色，绿色和蓝色（RGB）照明源来收集图像和/或定位缺陷，以改善图像质量。 在一些实施例中，在存在可变样本运动的情况下，照明源被脉冲宽度调制以实质上一致的光强度。 在一些实施例中，台架组件被配置成支撑样品，而不阻挡对被支撑的样品表面的接近，并且还被配置为减少样品的振荡或振动。 在一些实施例中，照明系统包括成像路径和聚焦路径以允许全视野聚焦。

公开(公告)号：US09689804B2

公开(公告)日：2017-06-27

申请号：US14577374

申请日：2014-12-19

Applicant: KLA-Tencor Corporation

Inventor： Yakov Bobrov

IPC: G01B11/24 ,  G01N21/88 ,  G01N21/95 ,  H01L21/66

CPC classification number: G01N21/8806 ,  G01B11/24 ,  G01N21/9501 ,  G01N2201/02 ,  G01N2201/06113 ,  H01L22/12

Abstract: A system for inspecting a backside surface of a wafer with multi-channel focus control includes a set of inspection sub-systems including a first inspection sub-system positioned and an additional inspection sub-system. The first and additional inspection sub-systems include an optical assembly, an actuation assembly, where the optical assembly is disposed on the actuation assembly, and a positional sensor configured to sense a position characteristic between a portion of the optical assembly and the backside surface of the wafer. The system also includes a controller configured to acquire one or more wafer profile maps of the backside surface of the wafer and adjust a first focus position of the first inspection sub-system or an additional focus position of the additional inspection sub-system based on the received one or more wafer profile maps.

公开(公告)号：US20150233841A1

公开(公告)日：2015-08-20

申请号：US14577374

申请日：2014-12-19

Applicant: KLA-Tencor Corporation

Inventor： Yakov Bobrov

IPC: G01N21/88 ,  G01B11/24 ,  G01N21/95

CPC classification number: G01N21/8806 ,  G01B11/24 ,  G01N21/9501 ,  G01N2201/02 ,  G01N2201/06113 ,  H01L22/12

Abstract: A system for inspecting a backside surface of a wafer with multi-channel focus control includes a set of inspection sub-systems including a first inspection sub-system positioned and an additional inspection sub-system. The first and additional inspection sub-systems include an optical assembly, an actuation assembly, where the optical assembly is disposed on the actuation assembly, and a positional sensor configured to sense a position characteristic between a portion of the optical assembly and the backside surface of the wafer. The system also includes a controller configured to acquire one or more wafer profile maps of the backside surface of the wafer and adjust a first focus position of the first inspection sub-system or an additional focus position of the additional inspection sub-system based on the received one or more wafer profile maps.

Abstract translation: 用于通过多通道聚焦控制来检查晶片的背面的系统包括一组检查子系统，包括定位的第一检查子系统和附加的检查子系统。 第一和附加检查子系统包括光学组件，致动组件，其中光学组件设置在致动组件上，以及位置传感器，其被配置为感测光学组件的一部分与背面侧面之间的位置特性 晶圆。 该系统还包括控制器，该控制器被配置为获取晶片的背面的一个或多个晶片轮廓图，并且基于所述第一检测子系统的第一焦点位置或附加检查子系统的附加焦点位置 接收到一个或多个晶片轮廓图。